Heterogeneous Integration D
Aalto University
<p>The contents of the course will include and introduction to microelectronic 3D-integration, specifically technologies utilised in IC, MEMS/ASIC, sensor systems and power components. Following this, the basics of materials compatibly, chemical reaction between materials, interfacial phenomena and their effects on material properties will be presented with examples and exercises applied to microelectronic integration. Interpretation of phase diagrams, diffusion mechanisms and microstructures of common microelectronic systems will be presented. The students will also participate in teardown laboratory that will critically evaluate commercial microelectronic components.</p>
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Course dates
01 September 2025 - 01 December 2025
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Course organizer
Mervi Paulasto-Kröckel, Vesa Vuorinen, Glenn Ross, Nikhilendu Tiwary
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Place/Venue
School of Electrical Engineering / Department of Electrical Engineering and Automation
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City
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Country
Finland
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Workload
5
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Link
https://mycourses.aalto.fi/course/search.php?...
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